Printing Industries of America is pleased to announce that Dr. Mark Bohan, vice president, Technology and Research, will present two sessions, Digital Press Integration: DOs & DON'Ts for Commercial Print Workflows and "Smart" Package Printing: Value-Add BEYOND the Graphics, at GRAPH EXPO 15, September 13–16, in Chicago.
Mark, who joined Printing Industries of America in July 2004, is responsible for the Center for Technology and Research; Environmental, Health, and Safety; Consulting, and is the Managing Director for the Technical Association of the Graphic Arts (TAGA). He was recently elected to the Board of Directors for CIP4 as the Membership Officer.
Mark is active in an extensive range of printing, paper, and coating research looking at the latest trends in the industry. He has also been involved in many projects evaluating new technologies, their implementation, and the application of functional materials using different processes. He maintains close ties with many manufacturers, researchers, and practitioners in this field.
Mark's seminars will be particularly beneficial to business owners, CTOs, production managers, plant managers, and automation specialists.
Digital Press Integration: DOs & DON'Ts for Commercial Print Workflows
Sunday, September 13, 10:30 a.m.–Noon
At this session, attendees will learn the opportunities, challenges, and success that can be achieved by integrating digital into a commercial print workflow. Mark will take a deep-dive look into strategies for integrating into a commercial workflow, different models adopted in the industry, and solutions for job submission workflow.
"Smart" Package Printing: Value-Add BEYOND the Graphics
Monday, September 14, 2:00–3:30 p.m.
When it comes to innovations in packaging, the future is now. The real game changer is the advent of "smart packaging," which allows the customer to directly interact with the product or provide crucial information regarding the condition of the product, both at the point of purchase and importantly, after they have left the store or the product has been delivered. To help guide attendees, Mark will lead a discussion involving active and intelligent packaging, the latest innovations in the market, as well as where the market opportunities lie.
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