CIRCL-AP™ and ICOS® T830 Support Advanced Packaging from Wafer-Level to Final Component

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded the Bipartisan Congressional Trade Priorities and Accountability Act of 2015 (TPA-2015), legislation introduced today by Senate Finance Committee Chairman Orrin Hatch (R-Utah), Ranking Member Ron Wyden (D-Ore.), and House Ways and Means Committee Chairman Paul Ryan (R-Wis.). The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage. Additionally, SIA president and CEO John Neuffer released the following statement in support of the bill:

TE's NG4access Optical Distribution Frame to Highlights Display and TE's Pat Thompson to Speak about Managed Connectivity

Company to Present Speakers, Solutions Throughout North America

Anritsu announces it successfully completed testing of GCT Semiconductor's 4G LTE-Advanced chip, GDM7243Q, using Anritsu's MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world's first 4X4 MIMO carrier aggregation for LTE. GDM7243Q's operation and 4X4 MIMO capabilities have been tested on Anritsu's signaling testing system.

LPKF has received an order worth EUR 2.5 million from a Chinese electronic manufacturer for Laser Direct Structuring (LDS) systems. This is the first phase of a large-scale order LPKF was expecting in the fourth quarter of 2014, but which the client postponed.

LPKF brings innovative technologies and HR specialists to HMI

• DesignWare IP on TSMC 16FF+ Processes Enables Designers to Accelerate Development of Mobile and Enterprise SoCs
• DesignWare Interface PHY IP portfolio for TSMC 16FF+ processes includes USB 3.0, 2.0 and HSIC; 16G PHY; PCI Express 4.0, 3.0 and 2.0; SATA 6G; HDMI 2.0; MIPI D-PHY; DDR4 and LPDDR4/3/2 IP
• DesignWare Embedded Memories for the TSMC 16FF+ processes include high-speed, high-density and ultra high-density SRAM, Register File and ViaROM memory compilers
• DesignWare STAR Memory System is optimized to provide high test coverage and efficient repair of FinFET-based memories