Product line offers a broad range of reliability and assembly benefits for home appliances and other high-current, high-temperature applications --

Extends Leadership in RT FPGAs by Providing 150K Logic Elements and 300MHz Performance

Companies Extend 55nm Embedded Flash Collaboration with Unique Packaging Innovation

Mentor Graphics Corp. (NASDAQ: MENT) today announced that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification. Calibre® physical verification and design for manufacturing (DFM) platform, and the Analog FastSPICE™ (AFS™) Circuit Verification Platform, including AFS Mega, are certified by TSMC based on the most current version of 10nm design rules and SPICE models. New tool feature enhancement based on 10nm process requirements has been made in Olympus-SoC™ digital design platform with TSMC validation, and certification of full chip integration is actively on-going. In addition to 10nm, Mentor has also completed 16FF+ version 1.0 certification of the Calibre, Olympus-SoC and AFS platforms. These certifications provide designers with the earliest access to signoff technology optimized for TSMC's most advanced process nodes, with improved performance and accuracy.

ANSYS, Inc. (NASDAQ: ANSS) announced today that its ANSYS® RedHawk™ and ANSYS Totem™ products are certified by TSMC for the most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models, addressing the power and performance requirements for mobile, computing and networking applications. TSMC has certified these solutions for static and dynamic voltage drop analysis and advanced signal and power electromigration (EM) verification to meet the 10-nanometer requirements.

Xilinx, Inc. (NASDAQ: XLNX) today announced it will highlight multiple next generation Ethernet, SDN and data center acceleration technologies in presentations and demonstrations at Ethernet Technology Summit 2015. To learn more, join Xilinx at the presentations listed below or visit us at ETS Booth #100, April 15 - 16, at the Santa Clara Convention Center, Santa Clara, CA.

New MCU includes advanced memory and security features for IoT and EMS devices

• Expanded StrataGX™ Product Line Increases Security, Adds NFC and Improves Power Management for Mobile Payment Terminals, PCs and More
• Industry's highest performance secure microcontrollers (MCUs) extend reach into range of low-power connected devices
• Near field communication (NFC) enables multiple "tap-to" actions for mobile point-of-sale (mPOS) terminals, home automation and various Internet of Things (IoT) products
• Integrated BroadSAFE™ architecture delivers advanced security to small form factor devices