Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of the TPD7104F, a single channel, high-side, N-channel power MOSFET gate driver designed for use in automotive applications.

Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) equipment and solutions for global industries, introduces a novel, patented method to extend the service life of pumps and compressors.

• DesignWare EV Processor Family Delivers Faster Object Detection with Significantly Lower Power Consumption
• New DesignWare EV Processor Family dramatically increases accuracy and performance for embedded vision applications such as video surveillance, gesture recognition and object detection
• Multicore architecture optimized for vision applications delivers over 1000 GOPS/Watt with 5X better power efficiency than other available vision processors
• Comprehensive programming environment based on emerging embedded vision standards such as OpenCV and OpenVX simplifies application software development

Highly integrated DC/DC converter for space-constrained automotive and communication applications features up to 95-percent efficiency

New MSP430™ MCU platform extends ultra-low-power leadership to ARM® Cortex®-M4F core to minimize power consumption while maximizing performance

Support Command Queuing, Secure Write Protection Features

New QNG4 and QHDEP Frame and Panels Support Higher-Density Applications

Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry's broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization.